This website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
This Website Uses Cookies By closing this message or continuing to use our site, you agree to our cookie policy. Learn MoreThis website requires certain cookies to work and uses other cookies to help you have the best experience. By visiting this website, certain cookies have already been set, which you may delete and block. By closing this message or continuing to use our site, you agree to the use of cookies. Visit our updated privacy and cookie policy to learn more.
Benny Koene, application and product support engineer, Adimec. For more information, call +31402353900, email enugteren@adimec.com or visit www.adimec.com.
The electronics industry is driven by the trend for more GOPS (Giga-Operations per Second) per mm3. This requires smaller technology nodes in wafer manufacturing, a drive to advanced packaging, as well as back-end inspection of the smaller interfacing components like micro-bumps, distribution layers, etc.